封装用铜框架表面化学组成和粘接强度

Surface composition and adhesion strength of copper leadframes for electronic packaging

电子封装用铜框架表面采用不同温度处理,与电子封装用环氧材料复合制备用于拉伸测试的Tap pull样品。XPS分析表明,一般铜框架表面成分包括一价的氧化亚铜和二价的氢氧化铜等。175℃热处理120 min可使表面的二价氧化铜质量分数达到73%,氧化铜和表面约20%的氢氧化铜一起显著提高界面的粘接性能。

Copper leadframes were treated at different temperatures and then used to prepare tensile test samples with the epoxy moulding compounds （EMC）. XPS analysis indicates, the surfaces of raw copper leadframes are mainly composed of cuprous oxide and cupric hydroxide. Deep thermal treatment （175℃, 120 min） can lead to a more oxidized surface, that is mainly composed of cupric hydroxide and cupric oxide with cupric oxide mass fraction of 73%.