摘要
通过ANSYS有限元分析软件对TO-263器件功率MOSFET管进行电-热-机械耦合分析,并对其热疲劳寿命作出预测。首先进行了瞬态热分析,得出了芯片的热通量变化图,在此基础上进行模拟并通过Coffin-Manson定律预测功率MOSFET管的热疲劳寿命。结果表明,TO-263器件功率MOSFET管的热疲劳失效循环总数为6 113。
Electric thermal mechanical coupling analysis of TO-263 power MOSFET tube was implemented by using ANSYS FEM analysis software and the tube’s thermal fatigue life was predicted. Firstly, the transient thermal analysis was carried out and the thermal flux variation graph was achieved, then the simulation was realized and the thermal fatigue life of power MOSFET tube was predicted through the Coffin-Manson＇s law. Results show that the total cycle sum of the thermal fatigue failure of TO-263 power MOSFET tube is 6 113.
出处
《电子元件与材料》
CAS
CSCD
2015年第1期96-99,共4页
Electronic Components And Materials
