并联导热结构的金刚石/铜基复合材料的制备

Preparation of Diamond/Cu Composite Material with Paralleling Heat Conduction Structure

为提高金刚石/铜基复合材料的导热性能,在芯材表面预先化学气相沉积(CVD)高质量金刚石膜,获得柱状金刚石棒,再将其垂直排列,填充铜粉后真空热压烧结,制备并联结构的金刚石/铜基复合材料。分别采用激光拉曼光谱(Raman)与扫描电子显微镜(SEM)对CVD金刚石膜的生长进行分析,并通过数值分析讨论复合材料的热性能。结果表明:金刚石/铜基复合材料结构致密,密度为9.51g/cm3;CVD金刚石膜构成连续的导热通道,产生并联式导热,复合材料的热导率为392.78 W/(m·K)。

In order to increase thermal conductivity of diamond/Cu composite material,high quality diamond films were deposited on core materials by chemical vapor deposition（CVD）,and then those diamond bars were longitudinally arranged with copper powder filling in the space to prepare paralleling heat conduction diamond/Cu composite by vacuum hot-press sintering method.The growth of diamond films was investigated by Raman spectroscopy and scanning electron microscopy（SEM）,and heat conduction performance of diamond/Cu composite materials was discussed by numerical analysis.The results show that the paralleling structure diamond/Cu composite material is compact and the density is 9.51g/cm^3.The CVD diamond films present continuous channels and generate paralleling heat conduction in the copper matrix,where the thermal conductivity is 392.78W/（m·K）.