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便携式均热板性能测试系统设计 被引量:1

Design of Portable Vapor Chamber Performance Test System
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摘要 均热板的主要性能参数包括均温性和传热功率,这两大参数指标直接反映均热板性能的优劣。基于实际均热板测试需要,设计了一种均热板测试系统,具有携带方便、自动化程度高等特点。测试系统主要由加热与冷却模块、控制模块、数据采集与分析模块三大部分组成,合理地运用了浮动支撑、滑动副、球关节浮动接头等机械结构减小了测试过程中可能出现的误差,运用Lab VIEW设计的数据采集分析系统确保了测试精度和可靠性,并运用了传热与传质基本原理分析计算了系统板翅热沉的热阻,其值为0.0871(℃/W),为进一步理论分析提供了依据。 The main parameters of the vapor chamber are the average temperature and the power of heat transfer, those two are directly response to the vapor chamber performance whither good or bad. Based on the vapor chamber actual test requires, the design of the vapor chamber test system is portable and with a high degree of antomatior~ The test system consists of heating and cooling module, control module, data acquisition and analysis module. The floating support, the sliding friction pairs, the floating ball joints and other structures are rational designed to reduce the errors that may occur during the test. And use the LabVIEW to design a data acquisition and analysis system to ensure the accuracy and reliability of the test device. Apply the.fundamentals of heat and mass transfer to analysis and calculation the thermal resistance of the system plate fin sink, the value is 0.0871 ( ℃/W ) , and to lay the foundation for further theoretical analysis.
出处 《机械设计与制造》 北大核心 2014年第12期26-29,共4页 Machinery Design & Manufacture
基金 国家自然科学基金项目(51175186) 广东省自然科学基金项目(x2jq B6130560)
关键词 均热板 测试 传热性能 热阻 Vapor Chamber Test Heat Transfer Performance Thermal Resistance
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参考文献10

  • 1Shu J S.Analysis of thermal performance in a micro-flat heat pipe with axially trapezoidal groove[J].Tamkang Journal of Science and Engineering,2003,6(4):201-206.
  • 2Go J S.Quantitative Thermal performance evaluation of a cost-effective vapor chamber heat sink containing a metal-etched micro-wick structure for advanced microprocessor cooling[J].Sensors and Actuators aPhysical,2005,121(2):549-556.
  • 3Wang J C,Wang R T,Chang T L.Development of 30Watt high-power LEDs vapor chamber-based plate[J].International Journal of Heat and Mass Transfer,2010,53(19):3990-4001.
  • 4Naphon P,Wongwises S,Wiriyasart S.Application of two-phase vapor chamber technique for hard disk drive cooling of PCs[J].International Communications in Heat and Mass Transfer,2013(40):32-35.
  • 5Wong Shwin-Chung,Huang Siao-Fang,Hsieh Kuo-Chun.Performance tests on a novel vapor chamber[J].Applied Thermal Engineering,2011,31(10):1757-1762.
  • 6Ji Xian-bing,Xu Jin-liang,Abanda Aime Marthial,Copper foam based vapor chamber for high heat flux dissipation[J].Experimental Thermal and Fluid Science,2012(40):93-102.
  • 7纪献兵,徐进良,Abanda Aime Marthial,薛强.超轻多孔泡沫金属平板热管的传热性能研究[J].中国电机工程学报,2013,33(2):72-78. 被引量:24
  • 8厉春元,郑燕妮,刘吉普,杨湘洪.翅片热板散热器的传热研究[J].机械设计与制造,2007(7):112-114. 被引量:8
  • 9朱英文,陆晓东.大功率半导体器件用散热器风冷热阻计算[J].电力电子,2009(6):47-51. 被引量:18
  • 10Incropera F P,Lavine A S,De Witt D P.Fundamentals of heat and mass transfer[M].John Wiley&Sons,2011.

二级参考文献28

  • 1郑艳妮,刘吉普.倾斜角度变化对螺旋翅片热管传热性能的影响[J].化工装备技术,2004,25(4):19-22. 被引量:3
  • 2卢天健,何德坪,陈常青,赵长颖,方岱宁,王晓林.超轻多孔金属材料的多功能特性及应用[J].力学进展,2006,36(4):517-535. 被引量:253
  • 3Siddique A.Khateeb,Shabab Amiruddin.Thermal management of Li-ion battery with phase change material for electric scooters[J].Power Sources,2005,142(1-2):345-353.
  • 4Shu J S. Analysis of thermal performance in a micro-flat heat pipe with axially trapezoidal groove[J]. Tamkang Journal of Science and Engineering, 2003, 6(4): 201-206.
  • 5Go J S. Quantitative Thermal performance evaluation of a cost-effective vapor chamber heat sink containing a metal-etched micro-wick structure for advanced microprocessor cooling[J]. Sensors and Actuators a-Physical, 2005, 121(2): 549-556.
  • 6Cao Y, Gao M. Experiments and analyses of flat miniature heat pipes[C]//Energy Conversion Engineering Conference. In. IECEC 96 Proceedings of the 31st Inter society, Washington, DC, USA, 1996.
  • 7Hophins R, Faghri A, Khrustalev D. Flat miniature heat pipe with micro capillary grooves[J]. Journal of Heat Transfer, Transactions of the ASME, 1999(121). 102-109.
  • 8Wang Y X, Peterson G. Analysis of wire-bonded micro heat pipe arrays[J]. Journal of Thermo physics and Heat Transfer, 2002, 16(3): 346-355.
  • 9Shih C J, Liu G C. Optimal design methodology of plate-fin heat sinks for electronic cooling using entropy generation strategy[J]. IEEE Transactions on Components ard Packaging Technologies, 2004, 27(3): 551-559.
  • 10Vadakkan U, Chrysler G M, Mareety J, et al. A novel carbon nano tube based wick structure for heat pipes/vapor chamber[J]. Semi-Therm Proceedings, 2007(18-22): 102-104.

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