XPS-EDS联用技术分析金电极表面焊接不良的原因

Comparison of XPS and EDS analysis on the surface pollutants of a gold electrode

金电极焊接不良,影响产品质量,焊接不良产生的原因通常与表面存在污染物有关。本实验采用能谱仪(EDS)结合X-射线光电子能谱仪(XPS)对样品表面成分进行分析。分析结果表明,样品由Au、C、O、N等元素组成,而表面污染物中含有F元素,F1s的结合能为688.5ev,而C1s的结合能在291.7ev处有拟合峰,表明表面存在CF2污染,CF2污染是金电极焊接不牢的原因。

The welding defects of gold electrode will affect the quality of products .The causes of weld‐ing defects are usually related to the surface contaminants .In this paper ,energy dispersive spectroscopy （EDS） combined with X‐ray photoelectron spectroscopy （XPS） are employed to analyze the surface compo‐sition of the sample .The results indicate that the sample is consist of C ,O ,Au and N ,while the surface pollutants contain element of F .T he binding energy of F1s is 688.5 eV ,but one of C1s fitting peak is at 291.7eV .The result indicates that the CF2 pollution exists on the surface of gold electrode .Because of the CF2 pollution ,the welding of a gold electrode is insecure .