摘要
以高纯石英SiO2、氧化铝粉末为原料,采用传统固相反应法在1 580℃空气中烧结得到了致密的Al2O3封装陶瓷。研究了不同石英SiO2/Al2O3配比对Al2O3陶瓷的热学性能、力学性能及介电性能的影响。研究结果表明,当石英SiO2的质量分数为3.5%时,在1 580℃烧结温度下保温3h所得样品综合性能最佳。陶瓷试样密度为3.85g/cm3,抗弯强度达到517 MPa,热膨胀系数为6.6×10-6(300℃),介电常数为9.4。
Using high purity SiO~ and alumina powder as starting materials,A12Oa packaging ceramms were ob- tained by conventional solid state reaction method at 1 580 ℃ in ambient air. The effects of si02 additive on the ther- mal properties mechanical properties and dielectric properties of AleO3 ceramics were studied. The results showed that when the SiO2-doped amount was 3.5% ,the integrated performance of the sample sintered at 1 580 ℃ was the best. The density of sample was 3.85 g/cma , the bending strength of samples was 517 MPa, the coefficient of ther- mal expansion（CTE）was 6.6 × 10^-6 （300 ℃ ）, and the dielectric constant was 9.4.
出处
《压电与声光》
CSCD
北大核心
2014年第6期933-935,938,共4页
Piezoelectrics & Acoustooptics
基金
中央高校基本科研业务费专项基金资助项目(ZYGX2012J035)
关键词
氧化铝陶瓷
石英SiO2掺杂
抗弯强度
热膨胀系数
介电性能
alumina ceramics
SiO2-doping
bending strength
coefficient of thermal expansion （CTE）
dielectric properties
