双层布线技术研究

Research on Technology of Double-layer Routing

随着集成电路技术的发展,双层布线技术显得越来越重要。主要对双层布线中二次金属淀积前的通孔预处理技术进行了研究和探索,通过对反溅射时间、反溅射功率等不同工艺参数的对比实验,给出了最优的反溅射清洗工艺条件。

With the development of IC, the technology of double - layer routing is getting more and more important. This article studies the sputter- etch technology before the second A1- routing in process of double - layer routing. By the contrast of different experiments such as sputter - etch time and sputter - etch power, the optimized process conditions of the sputter - etch are provided.