半导体激光对骨折后疼痛的疗效观察

The effect of low-level laser on pain in patients with facture

目的:观察半导体激光对骨折后疼痛的疗效。方法:骨折后疼痛患者66例,骨折已行复位固定,将患者随机分为单纯药物组,药物联合半导体激光组两组,单纯药物组使用美洛昔康,7.5mg/次,2次/日。联合激光组在此基础上加用半导体激光治疗,距离皮肤3cm,照射面积10cm2,每个痛点照射5min,1次∕日。两组均于治疗前、干预后第一天、第二天、第三天、一周、两周进行视觉模拟评分评价。结果:治疗前两组差异无统计学意义(P>0.05);干预2周后单纯药物组的VAS评分0.63±0.74,联合半导体激光组的VAS评分0.36±0.48,两组VAS评分差异有统计学意义(P<0.05)。结论:药物联合半导体激光比单纯药物治疗更能有效减轻骨折后疼痛。

Objective：To assess the influence of low-level laser irradiation on the clinical function in patients with facture.Materials 66 patients with facture were randomly divided into drug group（control group） and assisted laser group（experimental group）,with 33 cases in each group.All the patients in two groups received the same specification medication.While patients in experimental group additionally treated with OMEGA-2001 semiconductor laser（UK） for 5 minutes on each irradiation sites daily.The visual analogue scale（VAS） was used to assess the pain in two groups.Results：VAS scores in experimental group were significantly lower than that in control group（P〈0.05）.Conclusion：Early application of low-level semiconductor laser may be an alternative to relieve pain due to fracture in patients.