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EP/DDM固化工艺及增韧改性研究

EP/DDM Curing Process and Toughening Modification
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摘要 采用差示扫描量热法(DSC),根据Kissinger方程和Flynn-Wall-Ozawa方法,研究固化体系的固化动力学,运用非等温升温速率的方法确定EP/DDM固化体系的最佳固化工艺,选用011N和010N型奇士增韧剂对固化物力学和介电性能进行对比.结果表明:固化反应活化能Ea为52.76k J/mol;运用T-β外推法,确定EP/DDM固化体系的最佳固化工艺为80℃/2 h+125℃/1 h+160℃/1 h,此时固化物的拉伸强度和冲击强度达到最佳分别为65.52 MPa和24.29 k J/m2,分别提高了8.84%和32.52%;介电常数和介电损耗分别为3.11和0.003 2,固化物的绝缘性能较好,确定011N和010N型增韧剂最佳配比分别为16%和14%,此时固化物的冲击强度分别为29.85 k J/m2和26.87 k J/m2,分别提高22.89%、10.62%,实现了增韧改性的效果. Using differential scanning calorimetry (DSC) and according to the equation of Kissinger and the method of Flynn-Wall-Ozawa, the curing kinetics of curing system is studied. The best curing process for the curing system of EP/DDM is determined by using the method of non-isothermal heating rate and the mechanical and dielectric properties of the cured are compared by using two kinds of 011N and 010N QiShi toughening agents. The results show that:the activation energy Ea for the curing reaction is 52.76 kJ/mol,the extrapolation method of T-f3 is used to determine the best curing process for the curing system:80 ℃/2 h + 125 ℃/1 h + 160 ℃/1 h,here the tensile strength and impact strength of the cured a- chieved to the best are 65.52 MPa and 24. 29 kJ/m^2, increasing by 8.84 % and 32.52 % respectively. Dielectric constant and dielectric loss are 3.11 and 0. 003 2, the insulation performance of the cured is bet- ter, and the optimum proportion of 011N and 010N QiShi toughening agent for the EP/DDM curing sys- tem is deter mined,they are 16 % and 14 % respectively. At this point,the impact strength of the cured is 29.85 kJ/m^2 and 26.87 kJ/m^2, increasing by 22. 89 % and 10. 62 % respectively, and achieving the toughening effect.
出处 《沈阳化工大学学报》 CAS 2014年第4期348-354,359,共8页 Journal of Shenyang University of Chemical Technology
关键词 环氧树脂 4 4-二氨基二苯基甲烷(DDM) 固化工艺 增韧剂 改性 epoxy resin 4,4-diaminodiphenylmethane ( DDM ) curing process toughening agent modify
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参考文献1

  • 1Kissinger H E. Reaction Kinetics in Differential The- mal Analysis [J]. Anal chem, 1957, 29:1702 - 1706.

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