甲基磺酸盐体系Pb-Sn-Cu合金镀液性能的研究

Study on Solution Performance for Methyl Sulfonate System of Pb-Sn-Cu Alloy Plating

测定了甲基磺酸盐体系Pb-Sn-Cu合金镀液的参数,测试了镀液的分散能力、深镀能力以及镀液的稳定性.试验表明:镀液的电导率随游离甲基磺酸浓度的增加而增大;电流效率随着电流密度的增大而降低;在镀液中加入添加剂,可以增大阴极极化及增加镀液的稳定性.

The parameters of methanesulfonate system for Pb - Sn - Cu alloy plating solution were determined, and the dispersion ability of plating solution and deep plating ability and the stability of the plating solution were tested. Experiment showed that the solution conductivity increases with the increase of the methanesulfonic acid concentration; and current efficiency is lower with the increase of current density ; the cathodic polarization increa- ses the stability of the plating solution increase when the additives were added in the plating solution.