电子组装用无铅软钎料研究最新进展

Development of new lead-free solders

随着电子工业的发展,Sn基无铅钎料的研究成为电子材料研究中的一个重要方面。新型无铅钎料的研究主要有微合金化和颗粒增强两种方法,近几年来国内外在该方面的研究成果丰富,新型无铅钎料主要表现在单一性能或者综合性能的提高。但是由于新型无铅钎料系统性数据相对传统的Sn Pb钎料不完善,故而新型无铅钎料需要进一步的研究,为新型材料的广泛推广和应用提供数据支撑。

With the development of electric industry, the investigation of lead-free Sn-based solders have become the more important aspect in the field of electric materials. For the study, two ways such as alloying and particles strengthen can be utilized to research the new solders. In recent years, lots of works can be found in the world, these new lead-free solders represent obvi- ous single property or comprehensive properties. However, comparing with traditional SnPb solders, the systematical data of new lead-free solders is not enough, so the further study should be done to provide new data for series solders, which can be provided for data support.