基于ABAQUS的复合薄膜热结构有限元分析

Finite element analysis of thermal structure composite film based on ABAQUS

半导体硅基复合薄膜悬臂梁在温度场、加速度以及二者耦合场作用下,挠度和应力会发生变化。通过加热可使得驱动元件本身的温度升高,结构内部将会产生热应力,会导致两种薄膜各自产生线应变,线膨胀系数小的薄膜受到拉力作用,线膨胀系数大的薄膜受到压力作用,自由端会受到力矩作用而向线膨胀系数小的薄膜方向弯曲,从而导致悬臂梁的挠度发生变化。当弯曲悬臂梁有加速度作用时,会产生一个与加速度方向相同的力作用在悬臂梁上,同样会导致悬臂梁的挠度发生变化[1]。通过ABAQUS软件仿真[2],分别给出不同物理场中弯曲悬臂梁相对位移的大小,所得的结论为半导体硅基复合薄膜弯曲悬臂梁的应用装置提供了理论依据。

Under effects of temperature field, acceleration load and their coupling, deflection and stress of semiconductor silicon-based composite film cantilever will change. When the equipment is under heating condition, the temperature of itself will rise as well as thermal stress and strain will be generated. Due to the differences between expansion coefficients of films, small expansion coefficient of film is experienced pulling force, however, big one is experienced pressure force. Finally, the freedom of the cantilever will bend to the direction of the small linear expansion coefficient film, causing the deflection of the bended cantilever changes, when the bended cantilever in the effection of accelerations in Z aix direction, the deflection of the bended cantilever will also be changed. By ABAQUS simulation, the value of the displacement about bended cantilever in different physical fields are given. The conclusion provides a theoretical basis for the appliance of the device which used semiconductor silicon cantilever bending composite films.