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63Sn-37Pb和Sn-3Ag-0.5Cu合金钎料的扭转低周疲劳性能 被引量:2

Torsional Low Cycle Fatigue Properties of 63Sn-37Pb and Sn-3Ag-0.5Cu Alloy Solders
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摘要 用扭转疲劳试验机对63Sn-37Pb和Sn-3Ag-0.5Cu两种合金钎料在扭转载荷下的低周疲劳性能进行了研究。结果表明:两种钎料均为循环软化材料,它们的变形主要由塑性变形决定;两种钎料的疲劳寿命均随着剪应变幅的减小而显著增大;在相同的剪应变幅下,Sn-3Ag-0.5Cu合金钎料的疲劳寿命比63Sn-37Pb钎料的长,即Sn-3Ag-0.5Cu合金钎料的抗剪切疲劳能力更强。 The low cycle fatigue properties of 63Sn-37Pb and Sn-3Ag-0. 5Cu alloy solders at torsional load were studied by torsional fatigue tester. The results show that the two solders are cyclic softening materials and their deformation is dominated by plastic deformation. The fatigue life of the alloy solders all increased with decreasing the shear strain amplitude. Moreover, the fatigue life of Sn-3Ag-0. 5Cu solder was longer than that of 63Sn-37Pb solder at the same shear strain amplitude, indicating that the former had higher resistance to shear fatigue failure.
作者 郭洪强
出处 《机械工程材料》 CAS CSCD 北大核心 2014年第8期65-69,共5页 Materials For Mechanical Engineering
关键词 63Sn-37Pb合金 Sn-3Ag-0.5Cu合金 低周疲劳 扭转疲劳 疲劳寿命 63Sn-37Pb alloy Sn-3Ag-0. 5Cu alloy low cycle fatigue torsional fatigue fatigue life
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  • 1戴家辉,刘秀忠,陈立博.无铅钎料的立法与发展[J].山东机械,2005(1):7-9. 被引量:8
  • 2梁文杰,彭红建.无铅钎料的研究开发现状[J].材料导报,2011,25(7):127-130. 被引量:5
  • 3ABTEW M, SELVADURAY G. Lead-free solders in micro- electronics[J]. Materials Science and Engineering, 2000,27 : 95- 141.
  • 4PANG J H L, XIONG B S, LOW T H. Low cycle fatigue study of lead free 99. 3Sn0. 7Cu solder alloy[J]. International Journal of Fatigue, 2004,26: 865-872.
  • 5PANG J H L, LOW T H,XIONG B S,et al. Thermal cycling aging effects on Sn-Ag-Cu solder joint microstrcture[J]. IMC and Strength Thin Solid Film, 2004,462/463 : 370- 375.
  • 6罗艳,高庆,杨显杰.63Sn-37Pb钎料合金耦合损伤时相关理论模型[J].机械工程材料,2008,32(11):78-81. 被引量:1
  • 7CHEN Gang, CHEN Xu, NIU Chang-dong. Uniaxial ratche- ting behavior of 63Sn37Pb solder with loading histories and stress rates[J]. Materials Science and Engineering: A, 2006, 421:238-244.
  • 8CHEN X,SONG J,KIM K S. Fatigue life of 63Sn-37Pb solder related to load drop under uniaxial torsional loading[J]. Inter national Journal of Fatigue, 2006,28 : 767-776.
  • 9BAI Ning, CHEN Xu. A new unified constitutive model with short- and long-range back stress for lead-free solders of Sn-3Ag-0. 5Cu and Sn-0. 7Cu[J]. International Journal of Plas ticity, 2009,25 : 2181-2203.
  • 10许天旱,赵麦群,刘新华.Sn-Ag-Cu系无铅焊锡成分的优化研究[J].电子元件与材料,2004,23(8):14-16. 被引量:17

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