摘要
采用硫氰酸盐—双氧水浸金体系从废电路板中回收金和银,详细考察了硫氰酸盐浓度、双氧水浓度、溶液pH、固液比、温度和搅拌速度等对金银浸出率的影响。结果表明,在0.05 mol/L H2O2、0.4mol/L SCN-、固液比1/250、搅拌速度200r/min、室温（-15℃）浸取8h的条件下,金、银浸出率分别超过90%和79%,铅浸出率为9.7%。
Gold and silver were recovered from waste printed circuit boards in thiocyanate-hydrogen peroxide systems.The effects of thiocyanate concentration,hydrogen peroxide concentration,pH value of solution,ratio of solid to liquid（S/L）,temperature and stirring speed on leaching rates of Au and Ag were investigated.The results show that leaching rates of Au,Ag and Pb are 90% above,79% above,and9.7%,respectively under the optimum conditions including H2O2 concentration of 0.05 mol/L,thiocyanate concentration of 0.4mol/L,S/L=1/250,stirring speed of 200r/min,room temperature（-15 ℃）and leaching time of 8h.
出处
《有色金属（冶炼部分）》
CAS
北大核心
2015年第1期57-61,共5页
Nonferrous Metals（Extractive Metallurgy)
基金
河南省高等学校青年骨干教师项目(2010GGJS-067)
河南省创新型科技人才队伍建设工程项目(2011)
关键词
硫氰酸盐
双氧水
废电路板
金
银
thiocyanate
hydrogen peroxide
waste printed circuit boards
gold
silver
