车灯用三维线路板LDS工艺过程缺陷分析

Defect Analysis of LDS Process for the 3D-circuit Board of Lamp

介绍LDS工艺的基本原理、材料及工艺过程。以新型LDS材料为原材料,通过注塑成型、激光化镀、表面贴装等技术完成车灯用三维线路板。重点阐述LDS工艺过程中出现的注塑不良、溢镀、漏镀、镀层气泡和材料鼓泡等缺陷,并对各种缺陷产生的原因进行试验分析。结果表明:三维线路板电气性能和整灯试验均满足试验要求,通过合理选材、改善设计、优化工艺、增加试验验证等手段克服和避免三维线路板过程缺陷,充分说明LDS工艺在车灯运用的可行性。

The basic principle, material and process of LDS technology were introduced. The novel LDS material was used as raw mate- rial. 3D circuit board of the lamp was completed through injection molding, laser, plating, surface-mount technology. Various defects ap- peared in the LDS process were introduced mainly, such as injection molding defects, over-metallization, plating leakage, coating-material bubbles on conductive tracks, base-material bubbles. The causes of various defects were tested and analyzed. The results show the electrical performance and the lamp test of 3D circuit board can fulfil the test requirements. The process defects of 3D circuit board can be avoided and overcame, through reasonable material selection, design improvement, process optimization, and tests increase. The results fully show the feasibility of the LDS technology used in automotive lamp.