介电分析法及其在电子电路基材研究中的应用

Introduction and application of DEA in the electronic circuits base materials

介电分析法(DEA)是采用介电法树脂固化监控仪,通过内置传感器,在树脂反应体系中输入波形信号,并检测信号在反应体系中的变化。DEA可以实时监测树脂固化反应过程中的离子粘度的变化,从而反映树脂固化反应情况,指导电子电路基材的生产过程。

DEA inserts a sensor in the resin reaction system, sends the waveform signal, and detects the change of the signal in the reaction system. It can be real-time monitoring of the ion viscosity in resin curing reaction process, thus reflecting the resin curing reaction, guiding the production process of the electronic circuits base materials.