摘要
SiCp/Al复合材料导电性差、膨胀系数低,尤其是不具备钎焊能力。为了满足封装壳体的良好钎焊性能,必须对其表面进行镀金改性处理。文中针对SiC体积分数高达60%以上的SiCp/Al复合材料进行镀金工艺研究,主要目的是解决镀金层与基材之间的结合力难题。通过工艺试验,采用工艺分步实施化学镀镍、热处理、电镀镍、电镀金步骤,得到的镀层表面光滑平整,没有明显的结瘤和夹杂,与基材的结合力强。该工艺作为SiCp/Al可焊性表面处理技术之一,对于其他铝基复合材料表面处理具有重要的参考价值。
SiCp/Al composite material has low conductivity and low expansivity , especially has no brazing ability. In order to obtain good brazing performance of packaging case, gold-plating modification treatment for its surface is essential. Gold-plating technology is studied in this paper for the SiCp/Al composite with more than 60% SiC volume fraction. The major objective is solving the binding force difficulty between gold coating and substrate. Through process experiment, steps of electroless nickel plating, heat treatment, nickel electro- plating and gold electroplating are adopted. Coating thus obtained is smooth and flat, and no obvious nodula- tion and inclusion are found. Its binding force with substrate is strong. As one of the surface treatment technol- ogy for SiCp/Al weldability, the process has important reference value for the surface treatment of other alumi- num matrix composites.
出处
《电子机械工程》
2014年第6期57-59,共3页
Electro-Mechanical Engineering
