摘要
文章通过对孔壁平均去钻污量的数据分析,研究了厚径比与孔壁平均去钻污量的规律,初步界定了等离子去钻污加工高厚径比的能力。通过对等离子去钻污均匀性的控制,控制平均去钻污量,从而得到高厚径比产品稳定加工品质。
This paper showed the control rules of average desmear volume with different aspect ratio by mass hole wall desmear data, and grasped the plasma process capability against the high aspect ratio through hole. It can obtain steady result for high aspect ratio board through hole process quality by controlling the plasma process uniformity.
出处
《印制电路信息》
2014年第8期28-31,共4页
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