高厚径比微小孔镀层均匀性改善研究

Research for improvement of high ratio and microhole's plate thickness uniformity

文章针对我公司垂直电镀线电镀高厚径比微小孔产品镀层均匀性不佳的状况,通过一系列实验分析,增加电镀前的处理方式提高了高厚径比微小孔产品的贯孔率,在阳极增加挡板,以及在浮架侧面进行开孔等改造措施,改善了电镀均匀性,使其均匀程度得到了提高。这有着较大的现实意义。

Based on our company vertical plating line high plating thickness to diameter ratio of micro hole product coating uniformity of poor condition, through a series of experimental analysis, by increasing the treatment before plating, we can improve the high thickness to diameter ratio of micro hole penetration hole rate of products. By finished at the anode added baffie, and take the measure of fioat bridge on opening, we improved the uniformity of the plating, and uniformity. It is of great significance in practice.