摘要
结合电路板阻焊塞孔工艺技术产品批产化,根据生产线现有设备的实际情况,解决阻焊塞孔印制板加工过程所遇到由于过孔阻焊塞孔不良(空洞及露铜等)而导致锡珠入孔,造成的短路异常风险隐患等各种工艺难题。采用此种工艺制作技术方法均可实现阻焊塞孔印制板产品的批量在线的加工。
The work of the paper is based on the project of “the batch production of the circuit board with the resistance welding and hole clogging technology”. The existing equipment is faced the short circuit or other fault because the solder ball has been easily fiown into the connection holes for the resistance welding and hole clogging. And the study concluded that this new technological processes has no damage effect on the batch production of PCB.
出处
《印制电路信息》
2014年第8期47-50,共4页
Printed Circuit Information
关键词
阻焊塞孔
过孔
先塞后印
阶段性固化
The Resistance Welding and Hole Clogging Technology Drilling Hole Clogging First and Printing Phase-Curing
