镍氧化对镀金板可焊性影响的深入探讨

The further discussion on the impact of nickel oxide on the solderability of plating gold

镀金板的可焊性问题,也是业界经常面临的难题。业内普遍认为是镍层有机污染严重、阻焊残留导致,而系统深入地研究很少。本文由生产实际出发并结合相关试验测试,从镍氧化的角度,对镀金板可焊性不良的机理进行了深入分析,找到关键影响因素,为改善提供切实有效的理论依据。

The solderability problems of the plating gold plate were in existence at all times. Now the theory that the serious organic pollution of nickel and the remnant solder mask resulted in the poor solderability had been accepted universally in PCB industry, but in-depth analysis and research about the theory was less. The factor of effect and the mechanism on solderability problems was discussed in this paper by means of some experiments connected to manufacture from the angle of nickel oxidation, and it hoped to be the technology support to improve the discoloration problem.