立体结构密集单元PCB层偏改善

Research on mis-registration improvement of dense cells of PCB

在阶梯槽底部制作插头的工艺已经开发成熟,但制作立体结构密集单元PCB产品出现层偏报废异常高的难题。以一款立体结构密集单元阶梯位插头的PCB产品为例,剖析阶梯位插头在制作过程中如何有效控制层偏。

Making gold finger on cavity bottom to produce the volume PCB has been used. But it is difficult to solve the serious mis-registration with the cavity layers. This paper focuses on how to reduce the mis-registration in the three-dimensions and dense cells of cavity broad with gold finger.