摘要
从第十三届世界电子电路大会论文汇集中归纳出一些印制电路技术热点,有基板材料、钻孔工艺、表面涂饰、埋置元件板、金属基板等,以便了解世界印制电路技术的发展动向。
By the collection of ECWC13 papers, this paper summed up the hot points of printed circuit technology, such as substrate materials and drilling technology, surface finishing, embedded component board, metal in board etc. in order to understand the development trend of printed circuit technology in the world.
出处
《印制电路信息》
2014年第9期5-7,14,共4页
Printed Circuit Information
