摘要
主要讲述在印制电路板的树脂磨板制作工艺中,电路板上非塞树脂的金属化孔易出现孔口铜偏薄、孔口形变、孔口露基材等孔损问题,分析其孔损的产生原因,并给出了一些改善方法,供业界工作者参考。
In this paper, it focuses on the production process of the resin grinding in PCB manufacturing. In circuit board, the non-plug resin is easy appear the defect such as the PTH hole edge copper thin, deformation, exposed material problems. This paper makes analysis of causes of the hole edge damaged, and gives some improvement methods, reference for industry workers.
出处
《印制电路信息》
2014年第9期37-40,共4页
Printed Circuit Information
基金
广东省省部产学研结合重大专项项目(项目编号:2012A090300007
项目名称:高频高速电路板和通信终端产品关键技术研发及产业化)支持
关键词
印制电路板
塞树脂
研磨
金属化孔
孔损
Printed Circuit Board
Resin Plugged
Grinding
PTH Hole
Hole Edge Damaged
