任意层互连生产技术研究

Any layer interconnection technology research

任意层互连(ELIC)是最高阶的高密度连接(HDI)制程,它可以比传统线路在层数相同的情况下,增加约30%层间互连;随着移动通讯产品功能需求的增加,ELIC技术被大举应用在智能手机及平面电脑等产品上。高阶ELIC线路板的生产不但流程长,且生产难度较大。本文对ELIC板的制作难点进行了分析,并提出相应的解决方法和生产注意事项,为ELIC工艺产业化提供必要的参考依据。

Any Layer Interconnection （ELIC） is the highest level of high-density connection （HDI） process. Compared with the traditional lines under the same condition of the layer number, ELIC can increased about 30%interconnection between the layers. With the development of mobile communications products, ELIC Technology is used in smart-phones and tablets and other products. High level ELIC Circuit board production not only has a long process but also has production dififculty. At present, just only a few circuit board companies grasp the skill. In this paper, it analyzed the dififculties of ELIC production, and provided corresponding solutions or production considerations. It can provide the necessary reference for ELIC technology industrialization.