摘要
由于近几年移动通讯类产品向轻、薄的迅猛发展,而承载部件主板的重量、厚度、体积等起到决定性的作用,故适合此类产品的新型材料薄布基材应用而生,本文主要阐述PCB制造端对板弯翘的预防、改善及矫正方法。
Due to the mobile communication products are developing rapidly towards lighter and thinner in recent years, and the main board as the main loading parts, whose weight, thickness and volume are playing the decisive roles, the application of new materials such like thin cloth substrate come into being. This article mainly elaborated the prevention and improvement correction method against warpage in PCB manufacturing.
出处
《印制电路信息》
2014年第12期10-13,共4页
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