盲孔电镀填平不良改善研究

The research about improvement on microvia filling plating

针对VCP槽填孔过程中出现的空洞、凹陷值偏大、漏填等品质缺陷问题,对其产生原因进行深入分析,并通过组织相关测试手段及试验进行验证,试验结果表明:导电性不良,喷嘴堵塞是造成空洞、凹陷值偏大的主要原因。漏填现象发生跟槽液中的气泡有关。

The reasons which led to the quality defects of void, dimple value too large, un-iflling and so on were analyzed deeply in the process of microvia iflling for the VCP bath .At the same time, they were veriifed by using the relevant test methods and experiment.The results showed that the electrical conductivity of collect was poor and some nozzles were blocked, which was the main reason led to the void, dimple value too larger causing the un-iflling phenomenon related to the bubble in bath.