摘要
文章从化学镀镍金板件的镍厚控制出发,对影响镍厚因素进行了探讨和比较分析,并对生产操作中镍厚控制给予处理建议,具指导和参考意义。
This article is mainly talking about the inlfuence factors of nickel thickness on ENIG board, so as to well control the nickel plating in production. Also it has a good reference for technology and operation.
出处
《印制电路信息》
2014年第12期49-51,共3页
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