摘要
文章主要针对选化板在沉镍金制程加工中,出现"镍厚度不足"或"板边无镍沉积",金盘面"凹坑"缺陷进行分析,对生产线加工参数、辅助设备、产品设计方面改善,解决产品质量。
The article mainly analyzes the impact of the insufifcient thickness of nickel, or slabs of nickel-free deposition, and made the analysis of the gold pad concave of the election ENIG in the ENIG PCB. It improves the process parameters, auxiliary equipment and the design of the product.
出处
《印制电路信息》
2014年第12期52-54,共3页
Printed Circuit Information
关键词
选化板
有机物
凹坑
The Election ENIG
Organic
Concave
