基于MCM-C工艺的3D-MCM实用化技术研究

Study on 3D-MCM Practical Technique Based on MCM-C Process

基于MCM-C(陶瓷厚膜型)工艺,实现了三维多芯片组件(3D-MCM)封装。解决了多层基板制作、叠层间隔离及垂直定位互连等关键工艺问题。制作出层间为金属引线互连结构的3DMCM样品。该样品具有体积小、重量轻、可靠性高等优点。经使用测试,样品的技术指标完全合格,使用情况良好。

Based on MCM-C thick-film technology, the three-dimensional multichip module （3INMCM） package structure was implemented. The critical technical problems were solved by practice, including multilayer substrate, laminated isolation and location of vertical interconnection, etc. Finally, 3D-MCM samples based on the structure of interconnect metallic line had been prepared. It had many advantages, such as small volume, light weight and high reliability. Through being tested and used practically, the results showed that the specifications met thc requirement. It could run smoothly.