电子微器件微尺度激光喷丸强化实验研究

Experimental Study on Micro Electron Component Treated by Micro-scale Laser Peening

微尺度激光喷丸是一种灵活、精准的加工工艺,能够广泛应用于微电子设备中的电子微器件中,以改善电子微器件的强度及可靠性要求。为了研究微尺度激光喷丸对电子微器件的强化机制,对电子微器件常用加工材料铜箔进行微尺度激光喷丸强化。微尺度激光喷丸及未喷丸铜箔材料表面轮廓度、变形情况及显微硬度进行对比分析。实验结果表明,激光光斑的搭接率对铜箔微变形深度有一定影响,随着激光光斑能量的增加,铜箔微变形深度逐渐增加,经过微尺度激光喷丸强化的铜箔表面显微硬度得到了显著改善。

Micro-scale laser shock peening（ μLSP） is a flexible and precise process that can potentially be applied to metallic structures in micro devices to improve strength and reliability performance. In order to understand the mechanism of μLSP process,a typical experiment was carried out for copper foils specimen with various process parameters. Surface morphology,deformation and hardness of the specimens were observed and characterized by 3D microscope system and situ nano-mechanical test system respectively. It is found that overlapping rate of laser spot has a little effect on microscopic deformation depth which increases slowly with the increasing of laser energy,and micro-hardness of the laser treated specimens was improved significantly.