金属电极玻璃封装器件安装强度试验方法研究

Research on Test Methods for Bond Integrity of Metal Electrode Leadless Face Diode

介绍了金属电极玻璃封装器件质量评价中存在的问题,确定了引起器件失效的外部应力、内部应力、挤压应力等因素,以及评价金属电极无引线玻璃封装器件安装强度的温度循环试验、弯曲试验和扭曲试验三项试验条件。

This paper introduces the mechanism of installed devices and leadless face diode problems in the provides three quality evaluation of metal electrode leadless, identifies the failure test methods for evaluating the bond integrity of metal electrode