摘要
As aerospace technology develops rapidly, higher demand for aerospace optic system is brought forward. With its excellent physical qualities, SiC becomes a very promising material for speculums. The material-remove mechanism of SiC surface polishing is studied, that is, the grinding mechanism of ceramic material. Indentation fracture model is also introduced and is used to explain material-relnove mechanism of SiC surface polishing, and the model of SiC polishing in ideal condition is analyzed. Finally, the material-remove mechanism of SiC polishing in real state is studied.
As aerospace technology develops rapidly, higher demand for aerospace optic system is brought forward. With its excellent physical qualities, SiC becomes a very promising material for speculums. The material-remove mechanism of SiC surface polishing is studied, that is, the grinding mechanism of ceramic material. Indentation fracture model is also introduced and is used to explain material-relnove mechanism of SiC surface polishing, and the model of SiC polishing in ideal condition is analyzed. Finally, the material-remove mechanism of SiC polishing in real state is studied.
