摘要
小型化、高性能的BGA无铅器件已成为现代高集成度电子产品的组装必需器件,在其服役过程中,会经历热循环,出现失效。使用扫描电镜(SEM)、电子背散射衍射分析(EBSD)和显微硬度,对经历热循环BGA器件损伤模式进行了研究。得出结论:材料的热膨胀系数失配为裂纹萌生和扩展提供了驱动力,裂纹沿着钎料球内部弱化的局部再结晶晶界扩展,最终导致焊点断裂失效。
The compact and high-performance Lead-free BGA device has become the high integrated device which is required in electronics assembly. In the course of service, they experience thermal cycling and maybe invalid. The failure mode of BGA device, which has undergone the thermal cycling, is investigated by scanning electronic microscope, electron back scattered diffraction and micro Vickers hardness tester. It concludes that the mismatch of the coefficient of thermal expansion between materials provides the driving force for the initiation and propagation of cracks which are along the grain boundaries of the local recrystallization weakened in the solder ball, and eventually the fracture of solder joint occurs.
出处
《电子工艺技术》
2015年第1期12-14,24,共4页
Electronics Process Technology
基金
国防基础科研(基金编号:A1120132016)
关键词
BGA
热循环
再结晶
BGA
Thermal Cycling
Recrystallization
