摘要
按简单立方晶格对金属质量分数为90%的锡膏内焊粉分布进行了建模,建模后锡膏在通孔回流焊过程中的收缩因子为52.36%。所建模型能够有效指导锡膏生产过程中焊粉与添加剂的配比,且焊粉堆积形成的较大空隙能为锡膏受热生成的气体提供逸散通道,形成气泡率低的焊点结构。按简单立方晶格模拟焊粉分布能够提高表贴细密引脚间距器件丝网印刷的分辨率,能够促进通孔插装器件与表贴元器件装联制程的统一。
Simple cubic lattice modelling for the solder powder in the solder pastes, which have about 90wt% metal content. The shrinking factor calculated using the modelling is 52.36% during the Pin-In- Paste solder process. Proportion between the solder powder and the additive can be determined when the solder pastes are manufactured. Moreover, the larger spacing among the solder powders can provided as the leaking passageway for the gas generated when the solder pastes are heated, so that low bubble rate solder forms. The modelling solid powder＇s distribution not only can improve the resolution of the printing for the fine pitch components, but also can promoting the assembling process of through hole and SMT components.
出处
《电子工艺技术》
2015年第1期21-24,共4页
Electronics Process Technology
关键词
通孔回流焊
晶体学建模
锡膏收缩因子
Pin-In-Paste solder process
Crystal modelling
Shrinking factor of solder paste
