摘要
为了适应电子产品小型化和高密度集成要求,高密度超多芯连接器被广泛使用。由于其引线数量多、间距小、焊接间隙微小等原因,传统手工焊接方法很难满足其焊接质量要求。对高密度超多芯连接器组装方法进行了研究。通过焊接工艺优化,成功实现了焊接间隙0.08 mm的LRMS系列连接器可靠焊接,一次组装合格率达到98%以上。
In order to adapt to the requirements on miniaturization and high density integration of modern electronic products, high-density and ultramulti-pin connectors are widely used. Due to its multi- pin count, small pin-to-pin space, small soldering gap and others, it is difficult using traditional manual soldering to meet the quality requirements. Study on the assembly process for high-density and ultramultipin connectors. It has been proved that LRMS series connectors with soldering gap of 0.08 mm can be successfully soldered by optimizing soldering process, the first assembly qualified rate is more than 98%.
出处
《电子工艺技术》
2015年第1期34-37,共4页
Electronics Process Technology
关键词
高密度超多芯连接器
微小焊接间隙
波峰焊接
High-density and ultramulti-pin connectors
Small soldering gap
Wave soldering
