高压模块的有机硅凝胶灌封工艺设计与改进

Silicone Gel Encapsulation Process Design and Improvement of High-Voltage Module

介绍了某高压模块产品灌封工艺技术。该高压模块主要由多级倍压整流电路组成,要求具有良好的绝缘、抗振及三防特性,因此采用一体化(即模具作为结构支撑件)的灌封结构设计,以实现小型化、模块化。针对高压模块的灌封要求,选用合适的灌封材料;并针对灌封中出现的问题,通过原因分析找相应问题的解决办法,然后对高压模块灌封工艺进行改进。根据几批次高压模块的试验结果,该灌封工艺技术满足模块的设计要求。

The potting technology for the high voltage module was introduced. The high voltage module mainly consists of a multilevel voltage doubling rectifier circuit, which needs high voltage insulation, anti vibration and moisture proofing, salt spray proofing and fungus proofing. In order to realize the miniaturization and modularization, the circuit and the encapsulating structure was designed as one body. The silicone gel was selected as potting material according to the characteristics of the high-voltage module, and the potting method was improved to slove the problem of the potting process. The experimental results of the high voltage module show that the potting technology is able to meet the design requirements for the high voltage product.