摘要
通过将Sn-3.0Ag-0.5Cu(SAC305)焊料在300°C条件下熔化,然后经空冷和炉冷的方法制备不同微观组织的SAC305焊料。经扫描电镜观察微观组织发现,随冷却速度的降低,金属间化合物Ag3Sn的尺寸及形态变化为:亚微米级小颗粒(直径约200 nm,存在于原始SAC305焊料中)→细针状(长约十几微米,存在于空冷焊料中)→小片状(长约十几微米,存在于空冷焊料中)→长条状(长上百微米,存在于炉冷焊料中)。
Commercial SAC305 solder were melted in stainless steel mould at 300℃, then various microstructures of SAC305 lead-free solder were obtained by cooling specimens in air and furnace. With the decreasing cooling rate, Ag3Sn exhibited a particle-like for commercial SAC305 solder （ about 200 nm in diameter）, needle-like with plate-like tails for air-cooled SAC305 solder （ about tens of microns long）, and large plate-like for furnace-cooled SAC305 solder （about hundreds of microns long）.
出处
《河北科技师范学院学报》
CAS
2014年第4期73-77,共5页
Journal of Hebei Normal University of Science & Technology
基金
河北科技师范学院博士基金资助项目
关键词
无铅焊料
凝固速度
微观组织
lead-free solder
solidification rate
microstructure
