线路板配套电镀项目环境影响因素的研究

Study on the Environmental Impact of Electroplating Project Supporting Circuit Board

经过研究,结合线路板电镀企业的污染治理需求,针对本地规划中的电路板加工园区进行了污水处理设计。同时,园区内其他可能存在的污染源均可以按照与其他行业园区相同的方法治理。

After the study, combined with the circuit board electroplating enterprises pollution control requirements for the circuit board processing park, local planning is analyzed in the design of wastewater treatment. At the same time, inside the park, other possible sources of pollution there shall be in accordance with the park and other industries the same treatment method.