镀镍金刚石的双脉冲复合电沉积搅拌上砂工艺

Diamond coating technology via electroplating dispensing by stirring

使用双脉冲电镀电源，利用霍尔槽实验，模拟搅拌上砂工艺。考虑到可操作性问题，需采取低电压实验环境，本实验通以2A 的电流强度。实验结果表明：在0~10 A/dm^2的范围内，搅拌上砂的金刚石含量与电流密度成正比；双脉冲电镀能够提供瞬时的高电压，改善电极的电化学极化，增强了金刚石的黏附能力与镀层金属的固结强度；将搅拌器的叶片放在合适的位置可以提高电流密度的利用率，提高上砂效果。

In this test,diamond electroplating dispensing by stirring was stimulated in hull cell,which double pulse electroplating power supply was adopted.In view of the production later,low voltage experiment environment should be taken.Therefore,2A electric current was set up.The experiment results showed that within 0 ~ 10 A/dm^2 ,diamond content was proportional to the current density;Double pulse electroplating power supply could produce high transient voltage which could enhance electrochemical polarization of electrode,and facilitate the adhesion of diamonds;The agitator blades in suitable place could improve the utilization rate of current density,and furthermore,it would improve the effect of electroplated diamonds.