摘要
作为当前工业自动化部署的两大面向服务架构(SOA)技术,DPWS和OPC UA已广泛应用于设备层。但是由于嵌入式设备的内存空间有限,操作系统简单,低功耗要求,尤其是对于一些低成本的芯片,给SOA技术在嵌入式领域的发展带来了很大挑战。因此文章从DPWS和OPC UA的架构体系以及它们在嵌入式设备中运行的内部机制和占用内存情况进行了比较分析,并明确了二者在嵌入式领域中的协同工作方向。
As service oriented architecture（SOA）technology,devices profile for web services（DPWS）and OPC unified architecture（OPC UA）were currently more appropriate for the deployment of industrial automation and the major candidates to be deployed at device level in a service-oriented industrial scenario. The embedded devices have small memory,simple operating systems and low-power requirement,especially for low-cost microchips,so that these problems bring great challenges to SOA technology. Therefore,the performance of DPWS and OPC UA was compared and analyzed from their architectures,inner mechanism and processed resource and their application prospects in embedded field were clarified.
出处
《自动化与仪表》
北大核心
2014年第12期5-8,17,共5页
Automation & Instrumentation
基金
国家科技重大专项基金资助项目(2013ZX03005004)
国家高技术研究发展计划(863计划)项目(2014AA041801)
中国科学院战略性先导专项(XDA06020602
XDA06020500)
关键词
SOA技术
DPWS
OPC
UA
嵌入式设备
service oriented architecture（SOA）
devices profile for web services（DPWS）
OPC unified architecture（OPC UA）
embedded devices
