自催化氧化还原技术处理PCB络合废水试验研究

Treatment of Printed Circuit Board Complex Wastewater by Technology of Autocatalytic Oxidation Reduction

针对PCB络合废水络合铜浓度高、COD难达标、可生化性差等特点,在研究铜对铁碳微电解和Fenton氧化的催化作用的基础上,采用催化铁内电解-Fenton催化氧化联合自催化氧化还原技术对PCB络合废水进行处理,并通过混凝实验进一步去除废水中污染物。零价铁可置换出络合铜中的铜,单质铜与零价铁可形成Fe-Cu催化还原体系,对Fenton氧化也具有催化作用,可有效提高废水的处理效果。通过单因素实验确定各工艺最佳反应条件,实验结果表明,催化铁内电解最佳工艺条件为:p H=2,反应时间为60 min,铁屑投加量为5 g/L;Fenton催化氧化最佳工艺条件为:p H=3,反应时间为60 min,H2O2投加量为15 m L/L;混凝实验PAM最佳投加量为10 mg/L。最佳工艺条件下废水COD和总铜去除率分别可达到94.5%和98.8%,B/C由0.12提高到0.32,废水可生化性得到显著提高,为后续处理创造了条件。

According to the problems of high concentrations of complex copper, difficult treatment and low biochemical degradation of printed circuit board complex wastewater, base on the catalytic action of copper for Fe/C micro-electrolysis and Fenton reagent, autocatalytic oxidation reduction techniques of catalytic iron inner electrolysis-Fenton catalyzed oxidation and the further treatment of coagulation for treating printed circuit board complex wastewater are studied. The catalyzed Fe- Cu process formed by the copper which replaced by iron, and the copper also has catalytic action for Fenton reagent, which can improve the efficiency of wastewater treatment. The optimum reaction conditions are studied through single-factor experiments. Results show that the appropriate parameters of catalytic iron inner electrolysis are pH 2, reaction time of 60 min, iron-carbon dosage 5 g/L; The appropriate parameters of Fenton catalyzed oxidation are pH 3, reaction time of 60 min, H2O2 dosage 15 mL/L; The appropriate parameters of coagulation is PAM dosage 10 mg/L. Under the optimum reaction conditions, the removal rates of COD and total copper are 94.5% and 98.8%, and B/C improved from 0.12 to 0.32, the biodegradability of wastewater is improved evidently and the good conditions for following treatment are created.