微小器件热特性测量新方法

New Measurement Method of Thermal Characteristics for Small Devices

微小器件热特性具有快速产生、不可逆、易损坏器件等性质,较难在瞬间捕捉到它变化的一些信息.为了研究微小器件热特性,本文引入了一种测试器件热性能的新方法——反射率热成像法,并对该种方法的成像原理、功能应用作了简单介绍.在实际测试小器件热特性过程中,应用反射率热成像系统与红外热像仪进行了对比测试,结果表明:反射率热成像系统空间分辨率更高,达到亚微米量级;时间分辨率更高,达到百纳秒级;对样品温度要求低,温度范围更大,不需要对样品加热;只需对新材料进行校准,无需对样品表面进行逐点校准.在要求高分辨率、超快速的微小尺寸热测试领域,反射率热成像仪有着很好的应用前景.

Small device thermal characteristics has the property of rapid,irreversible,easy to damage the device.So it is very difficult to capture the change in a moment.In order to study thermal properties of small devices.A new method———thermoreflectance thermography is introduced in this paper.The method＆#39;s principle,function and application are briefly introduced.In the test of thermal characteristic with thermoreflectance thermography and infrared thermography were compared,the results show that the thermoreflectance thermography has the higher spatial resolution to sub micron level,the higher time resolution to hundred nanosecond,the larger temperature range.The sample need low tempera-ture,wide temperature range and not heated.The system of new material need to be calibrated but not point by point.So it has a good application prospect in the field of small device thermal test which re-quires high resolution and ultra fast.