共聚聚酰亚胺的制备及在2层柔性覆铜板中应用

Synthesis of Copolyimide and Its Application to 2-Layer Flexible Copper Clad Laminate

通过调节二酐、二胺物质的量比来制备3,3′,4,4′-二苯酮四二酸二酐-3,3′,4,4′-联苯四酸二酐-对苯二胺-4,4′-二氨基苯醚(BPDA-BTDA-p-PDA-ODA)共聚型聚酰胺酸(PAA),热亚胺化后得到聚酰亚胺(PI)薄膜,并利用涂覆法制备PI柔性覆铜板。利用傅里叶红外光谱、热重分析、差示扫描量热仪、电子万能试验机、静态热机分析法等对PI薄膜以及其柔性覆铜板的相关性能进行表征。结果显示:随着二酐、二胺物质的量比的增加,PI的热稳定性、力学性能和柔性覆铜板的剥离强度都呈现出先提高后下降的趋势。当二酐与二胺物质的量比为1.015时,得到的PI薄膜性能最优,拉伸强度为138.68 MPa,起始分解温度为538.5℃,玻璃化温度为247.5℃,热膨胀系数为4.03×10-5℃-1,剥离强度高达11.96 N/m。

Polyamic acid of BPDA-BTDA-p-PDA-ODA copolymer was synthetised via adjusting the molar ratio of dicarboxylic anhydride to diamine. Polyimide （PI） film was obtained through thermal imidization. And the flexible copper clad laminates （FCCI.） were prepared by coating method. FCCL and PI films were characterized by Fourier trans- form infrared spectroscopy, thermogravimetry analysis,differential scanning calorimetry, e- lectronic universal testing machine, static thermomechanical analysis method, etc. The re- sults show that the thermal stability and mechanical properties of PI films, and peel strength of FCCL increase at first and then decrease with the increase of the molar ratio of dicarboxylic anhydride to diamine. When the molar ratio of dicarboxylic anhydideto to diamine is 1.015,the performance of PI film is optimal, which shows the tensile strength of 138.68 MPa, thermal decomposition temperature of 538.5 ℃,the glass transition temperature of 247.5 ℃, CTE of 4. 03×10^-6℃^-1 and peel strength of 11.96 N/m.