摘要
为解决某毫米波功率放大器芯片的散热问题,对功放腔体结构采用了一种一体化均热板的形式。通过这种新的设计方法,并通过热仿真和热测试的验证,证实使用了一体化均热板之后,可有效降低功放芯片的工作温度。
The integrated cooling solution of vapor chamber in MMW power amplifier is intro- duced in this paper. The temperature of MMW power chips can be significantly reduced by the so- lution which has been verified by thermal design and tests.
出处
《机械与电子》
2015年第2期38-40,共3页
Machinery & Electronics
关键词
均热板
平板热管
功率放大器
热设计
vapor chamber
fiatpipe
power amplifier
thermal designMMWthe so-designplate heat
