平行缝焊焊缝质量的评判

Assessment of Seam Quality in Parallel Seam Welding Process

平行缝焊是微电子单片集成电路及混合电路气密封装的一种关键密封工艺,其中焊缝质量的优劣对平行缝焊产品的密封质量、可靠性影响较大。虽然平行缝焊只是在盖板边缘进行局部加温,对外壳的整体升温比较低,但如果工艺控制不当的话,缝焊过程中同样会引入较大的热应力,导致焊环与陶瓷结合部位开裂,最终造成筛选、鉴定试验过程中的气密性失效。针对平行缝焊工艺中焊点、焊缝质量的评判方法进行了讨论。

Parallel seam welding is a criticallid sealing technology in hermetic packaging of microelectronics monolithic integrated circuit and hybrid circuits. For this process, the quality levels of welded seam contribute a lot to the final sealing quality and reliability. In this process, welding locally happens in the edge area of the lid, resulting a very low bulk temperature of the package. However, if it is not in good control during processing, a high thermal stress will be introduced during welding and result in the the cracking at the location between seal ring and ceramic, which will lead to leak failure during screening and qualification tests. The paper will focus on the discussion of the assessment of seam quality.