晶圆级传输线脉冲测试方法

Research of TLP Test Method for Wafer

随着晶圆测试技术的发展,晶圆级传输线脉冲(TLP)测试逐渐由封装级向晶圆级转移,晶圆级TLP测试的出现不仅降低了设计成本,同时大大缩短了ESD保护结构的评价周期。针对晶圆级TLP测试方法尚无标准可依的现实情况,结合理论推导过程,从线路搭建、设备校准、结果确认等关键点探索可行而有效的晶圆级TLP测试方法。

With the developments of wafer level testing technology, the TLP tested objects will be gradually transformed from packaged level into wafer level. Since the absence of the standard for wafer level TLP test, authors try to find an efficient way of testing method basing on explaining theory, building circuitry, calibrating equipment and judging results in the paper.