低黏度含硅芳炔树脂的制备与性能

Preparation and Properties of Low Viscosity Silicon-containing Arylacetylene Resin

在含硅芳炔树脂（PSA）中加入活性稀释剂制备了低黏度含硅芳炔树脂,研究低黏度PSA的流变性能和固化工艺,固化PSA树脂的热性能、力学性能和电气性能.结果表明：PSA中加入稀释剂可以显著降低其黏度,PSA树脂在氮气和空气中的5%热失重温度分别可达665.5 ℃和603.3 ℃,800 ℃残留率分别达到89.7%和53.8%;PSA 树脂的玻璃化转变温度高于500 ℃;加入10%质量分数稀释剂的PSA 树脂的弯曲强度可达到30 MPa,弯曲模量变化不大,25℃下在101-106 Hz内介电常数和介质损耗角正切分别小于3.24 和0.005.

A low viscosity silicon-containing arylacetylene resin（PSA） was prepared by adding reactive diluentto PSA, and the rheological property and curing process of the viscosity PSA, the thermal property,mechanical properties, and dielectric properties of the cured PSA were studied. The results show that theaddition of reactive diluent to PSA could make its viscosity decrease siginificantly. The thermal decompositiontemperatures at 5% weight loss of the cured PSA reach 665.5 ℃ in nitrogen and 603.3 ℃ in air,and its residual rate at 800 ℃ is 89.7% and 53.8%, respectively. The glass transition temperature of thecured PSA is higher than 500 ℃. The bending strength of the PSA attains 30 MPa after adding 10% ofreactive diluent, the bending modulus changes little, and the permittivity and loss tangent are less than3.20 and 0.005 at 25 ℃ ranging from 101 Hz to 10^6 Hz.