摘要
介绍了一种红外测温装置,装置由MCU处理器MSP430F149、非接触温度传感器TMP006和无线通信模块HC-06等组成。阐述了装置工作原理和发射率修正方法 ,介绍了硬软件设计方案和主要功能模块的实现过程。利用浴式黑体和标准铂电阻温度计做了静态校准。针对电磁炉典型加热过程,用该测温装置测量了锅具外壁面温度,并与工业用IRCON 74型红外测温仪的测量结果做了对比,测试结果表明可应用于电磁炉加热过程中的温度测量。
An infrared temperature measurement device was introduced. It consists of MCU processor MSP430F149, non-contact temperature sensor TMP006,wireless communication module HC-06. Describe the working principle of device and emissivity correction method,configuration of hardware,design of software and main function modules in the paper. We measure extra data points to provide over-determined curve fit analysis to verify the coefficients correctly characterize the sensor. Calibration was performed by comparison with a reference SPRT in stirred-liquid baths blackbody. We measure the temperature of the outer wall of the eookware by the device. Tests were performed by comparison with a reference IRCON 74 infrared thermometer. The results show that the temperature measurement device can be used for electromagnetic induction heating process.
出处
《自动化与仪表》
2015年第2期16-19,共4页
Automation & Instrumentation
基金
国家质量监督检验检疫总局质检公益性行业科研专项项目(201410133)
浙江省科技厅重大科技专项重点科研项目(213C01137)
关键词
电磁炉
红外测温
非接触温度传感器
黑体
electromagnetic induction heating equipment
infrared temperature measurement
non-contact temperaturesensor
blackbody
