云母电容器粉末包封工艺研究

Study on Powder Coating Technology for Mica Capacitors

介绍云母电容器粉末包封的关键工艺技术,指出包封外观气孔或气泡产生的本质原因是待包封元件内部存在气体间隙。在大量实践的基础上给出解决问题的途径——采用内封工艺。该工艺对各类电子元件的外层包封实现大批量生产有极其重要的现实意义。

Powder coating technology is presented. It is found that the pinholes and bulbs in the coating surface are caused by the air gaps within the components to be coated. Pre-coating is an ideal solution, which is acquired through experiment. The technology can be used in mass production.